Worldwide Semiconductor Capital Spending to Drop 4.7% in 2016
January 11, 2016 | Gartner, Inc.Estimated reading time: 1 minute
Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc. This is down from the 3.3 percent growth predicted in Gartner's previous quarter's forecast.
"The 2016 outlook for the semiconductor manufacturing equipment market reflects a bleaker outlook for end-user electronics demand and the world economic environment," said David Christensen, senior research analyst at Gartner. "Capital investment policies of leading semiconductor vendors have remained cautious against the background of sluggish electronics demand. However, the long-term outlook shows a return to growth, although the wafer-level manufacturing equipment market is expected to enter a gentle down cycle in 2016 due to the loss of the supply and demand balance in the DRAM market."
2016 spending on wafer-level manufacturing equipment is forecast to decline 2.4 percent. Within the forecast, different segments are expected to fare differently in response to varying end-market conditions. For example, the lithography segment will grow 1.4 percent, while the etch, clean and planarization equipment markets in 2016 are expected to decline by 2.9 percent. The deposition equipment segment will improve slightly in 2016 with negative 3.2 percent growth. Beyond 2016, the market turns positive, with relatively strong growth forecast through 2018.
This research is produced by Gartner's Semiconductor Manufacturing program. This research program, which is part of the overall semiconductor research group, provides a comprehensive view of the entire semiconductor industry, from manufacturing to device and application market trends. Additional analysis on the outlook for the semiconductor market can be found at "Forecast Analysis: Semiconductor Capital Spending and Manufacturing Equipment, Worldwide, 4Q15."
Suggested Items
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
05/06/2024 | DDM Novastar Inc.DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace Pick & Place systems. This new line introduces entry-level yet high-performance pick and place machines.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).