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Advanced Packaging Industry: What is New on the Market?
January 12, 2016 | Yole DéveloppementEstimated reading time: 3 minutes
• The foundry involvement is no longer a dent in advanced packaging production.
• Increased activity of Chinese capital on the market.
• And more …
At the level of technology, as profitability of FEOL scaling options remains uncertain and IoT promises application diversification, the spotlight is now turning to advanced packages for cost reduction, performance boost and functional integration.
In order to answer market demands, the advanced packaging segment focuses on integration and WLP . Emerging packages such as Fan-Out WLP, 2.5D/3D IC and related System-in-Package solutions aim to bridge the gap and revive the cost/performance curve.
How will the advanced packaging industry evolve, which changes in the semiconductor supply chain are taking place and which packaging technologies will be most critical in the years to come? Yole proposes with this new technology and market analysis, a deep understanding of the advanced packaging technical and market challenges. Under this new report, the market research and strategy consulting company brings a thorough analysis of the advanced packaging industry and its future development covering platforms Fan-Out WLP, Fan-In WLP, Flip Chip and 2.5D / 3D… A detailed description of this report is available on i-micronews.com, advanced packaging reports section.
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