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Advanced Electronics Packaging Digest

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BAE Systems Launches Shadow EW Compact Electronic Warfare Solutions

09/18/2026 | PRNewswire
BAE Systems has launched its Shadow EW™ family of compact electronic warfare (EW) solutions designed for a diverse and growing range of small airborne platforms.

Fujifilm to Showcase Semiconductor Materials and India Commitment at SEMICON India 2026

09/17/2026 | Fujifilm
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BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.

Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

Advanced Packaging and the New Scaling Walls

09/17/2026 | Chetan Arvind Patil, Marvell Technology
Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.
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