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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Remtec to Participate in EMS Industry Fly-In: Where Policy Meets the Production Line in Washington, D.C.

09/18/2026 | Remtec
President and CEO of Remtec, Brian Buyea Will Join The Industry Leaders in Advocating for a Stronger, More Resilient U.S. Electronics Manufacturing Base

FSQuality Circuits to Showcase Advanced PCB Manufacturing Capabilities at PCB West 2026

09/18/2026 | FSQuality Circuits
FSQuality Circuits (FQC), a leading Thailand-based manufacturer of advanced printed circuit boards, will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/18/2026 | Nolan Johnson, I-Connect007
The middle months of 2026 have been defined by, shall we say, “projects” throughout the industry, and as we approach the end of the third quarter, many of those projects are coming to light. That’s the theme I’m getting from this week’s news, and I tried to capture it with my selections. My must-reads include a market update on the leading fabless semiconductor houses, a call to action from SEMI directed at the policymakers in the European Union, a rollup of workforce and educational programs announced just this week, a role change at Indium, and the relaunch of the Global Electronics Association Sustainability teams’ DMA Toolkit.  

ICTC Philippines Expands Manufacturing Capabilities with New Facility in Laguna

09/18/2026 | ICTC Philippines
Interconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, is proud to announce that ICTC Philippines has reached a significant milestone with the opening of its new manufacturing facility at Lot 3 Block 2, Laguna Technopark Inc. Phase 7, Binan, Laguna 4024, strengthening the company’s presence in the Philippines and expanding its ability to support customers with advanced electronics manufacturing solutions.

REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing

09/17/2026 | Global Electronics Association
The Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil. Europe is one of the world’s three largest markets for AI data centres.
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