Advancements in Bioacoustics Sensing Set to Expand Electronics Capabilities
January 21, 2016 | Frost & SullivanEstimated reading time: 2 minutes
“Researchers are fine-tuning existing materials to boost the performance of sensors,” added Shastri. “Meanwhile, manufacturers are looking to employ novel techniques such as atomic layer deposition and chemical vapor deposition to lower the costs of production.”
With extensive research and stronger partnerships, this budding technology will grow leaps and bounds in the next ten years.
About Frost & Sullivan
Frost & Sullivan, the Growth Partnership Company, works in collaboration with clients to leverage visionary innovation that addresses the global challenges and related growth opportunities that will make or break today's market participants.
Page 2 of 2Suggested Items
DuPont Reports First Quarter 2025 Results
05/02/2025 | PRNewswireDuPont announced its financial results for the first quarter ended March 31, 2025.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Alternative Manufacturing Inc. (AMI) Appoints Gregory Picard New Business Development Manager
05/01/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing Inc. (AMI) is pleased to announce the appointment of Mr. Gregory Picard as our new Business Development Manager. Picard brings a wealth of experience in Sales and Business Development, having worked with some of the most prominent names in the industry.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine
05/01/2025 | I-Connect007 Editorial TeamAre you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in