Engineered Materials Systems Receives IDTechEx Award for Printed Electronics Technology
January 21, 2016 | Engineered Materials SystemsEstimated reading time: 1 minute
Nagase America is pleased to announce that Engineered Materials Systems, Inc. (EMS), a Nagase Group company, received the IDTechEx Best Commercialization Award for its achievement in printed electronics technologies at Printed Electronics USA 2015. The award was for the use of EMS’s stretchable conductive ink in Mimo, a wearable smart baby monitor manufactured by Rest Devices. Entries were judged by a panel of three industry experts.
“Mimo is a very innovative product, and we are honored to be recognized for our efforts in helping our customer solve a technical challenge and commercialize a new product,” said Todd Irion, president of EMS. “We are committed to partnering with customers to define and develop customized solutions.”
Rest Devices approached EMS with the need for a soft, stretchable conductive ink that was also very durable. The solution was CI-1036, a silver conductive ink with superior durability and adhesion to fabrics, in combination with a proprietary film and top coat. The combination enabled Mimo to withstand 90 wash/dry cycles, achieving Rest Device’s durability goal.
EMS manufactures a full product line of inks for use in wearable applications. CI-2051 is a stretchable carbon ink that can be used in creating stretchable capacitors. CI-4040 is a stretchable silver/silver chloride ink used in creating various biosensors. Any conductive traces can be protected with a layer of DI-7540 UV-cure dielectric ink.
About Engineered Materials Systems, Inc.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.
About Nagase America
Nagase America is a global leader in innovative solutions for the chemicals, plastics, electronics, life sciences and automotive markets. We are a member of the Nagase Group, founded in 1832 and now encompassing over 100 companies in 20 countries and 6,000 employees worldwide. For more information, visit www.NagaseAmerica.com or www.Nagase.co.jp/english/
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.