Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
ACE to Exhibit New Innovative Soldering Technologies at IPC APEX EXPO 2016
February 24, 2016 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies Inc., a supplier of selective soldering systems, lead tinning systems and lead tinning services, will exhibit new innovative soldering technologies in Booth 2022 at the IPC APEX Expo, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center in Las Vegas, Nevada.
A complete range of standalone selective soldering systems including the popular KISS-102 and in-line systems such as the KISS-101IL, KISS-103IL and dual pot KISS-103ILDP will be on display. All systems are equipped with graphics-based software and include automatic fiducial correction and board warp compensation as standard features at no additional cost.
Premiering at APEX, is the LTS300-JEDEC which is the most technologically advanced molten solder lead tinning system on the market consisting of two dynamic nitrogen inerted solder pots, a dynamic flat wave fluxing station, forced convection preheating, aqueous wash and drying stations, plus a JEDEC tray stacker forming a complete component re-tinning work cell.
At the heart of the new LTS300-JEDEC is a fully integrated vision system consisting of top and bottom viewing cameras for accurate alignment of electronic components prior to re-tinning to ensure complete control over fine-pitch components during immersion and extraction of the hot solder dip process. The vision system also performs post-tinning inspection to detect potential solder bridges before placing components back into a JEDEC tray. The LTS300-JEDEC is a fully-configured system capable of performing a molten solder component lead tinning process for gold removal and re-tinning of components for Class 2 and Class 3 applications in compliance with the new J-STD-001, Rev F requirements.
Also on display will be the revolutionary STS-202 dip and look solderability test system. The new ACE solderability tester is capable of performing solderability testing to determine the solderability of component leads and terminations prior to being joined in a soldering operation. The system utilizes the proven dip and look test method in conformance with all IPC, ANSI and MIL standards including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.