-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Time-Based Electrocardiogram (ECG) Readout Chip for Wearable Applications
March 4, 2016 | Holst CentreEstimated reading time: 2 minutes
Nanoelectronics research center imec and Holst Centre, an open-innovation initiative set-up by imec and TNO, present a 0.6V ECG readout chip in 40nm technology based on time-domain circuit techniques. The chip maintains consistent beat detection capabilities, even under movement (~40mVpp), paving the way to a low cost, low power multi-sensor Systems-on-Chip (SoCs) solution for wearable medical applications.
There is a clear need for emerging applications in personal healthcare to add more digital signal processing capabilities and memory storage within the system itself. While today's digital ICs and memory ICs benefit from technology scaling in terms of power and area, this has yet to be achieved for analog readout electronics. Current state-of the-art analog circuit techniques don't result in a significantly reduced area in scaled technologies, and due to the accompanied reduced supply voltage (VDD) with scaled technologies, the analog front-end readout chip faces significant challenges in combining a large dynamic range with small size and low power consumption.
The new ECG readout chip is only 0.015mm2 implemented in TSMC 40nm CMOS. It can handle up to 40mVpp AC sigma and up to 300mV DC-electrode offset while consuming only 3.3μW from a 0.6V supply. By acquiring an ECG signal from the noise-stress database, the system does not saturate and is able to maintain a consistent beat detection capability even in presence of vigorous motion (~40mVpp). This was achieved by implementing a time-domain-based readout architecture, which leverages the benefits of technology scaling and it avoids the need for area intensive analog circuitry, such as high-gain amplifiers and passives. The readout chip achieves performance that is comparable with current state-of-the-art implementations at a fraction of the area.
"Our breakthrough readout ECG chip paves the way to low-cost, low-power multi-sensor systems for ambulatory medical applications," stated Nick Van Helleputte, team leader biomedical circuits at imec. "Furthermore, it opens additional innovation paths for beyond 40nm analog front-end design, leveraging the power and area benefits of scaled technology in digital architectures."
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Celestica Provides Update on New Operations in Fort Worth, Texas
05/15/2026 | CelesticaCelestica Inc. a global leader in data center infrastructure and advanced technology solutions, provided an update on its plans to establish operations in AllianceTexas in Fort Worth, Texas.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.