-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Stadium’s Shanghai Design Centre Pushes Design-led Growth for Wireless Applications
March 11, 2016 | Stadium GroupEstimated reading time: 1 minute

On 16th February 2016, Stadium’s Board of Directors cut the ribbon to signify the official opening ceremony for its Regional Design Centre (RDC) in Shanghai’s Zhangjiang Hi-Tech Park, China.
In support of the Group’s wider strategy to further develop its design-led technology businesses, the Shanghai RDC has become an International Purchasing Office (IPO) and the Company’s regional research and development hub in wireless M2M connectivity for global OEM products in automotive, medical, security and other growing vertical markets. Driven by the Internet of Things (IoT), which continues to stimulate demand, the M2M space is forecast for high growth.
“The new Shanghai Regional Design Centre is an exciting move for Stadium that both strengthens our wireless capabilities and gives us access into new markets,” said Charlie Peppiatt, CEO, Stadium Group. “We have recruited a highly experienced team, including design engineers and field application engineers, specialising in wireless, RF and M2M technologies. Stadium’s presence in China, delivered by the new Shanghai RDC and manufacturing facility in Dongguan, positions the company to capitalise on a growing market opportunity and expand further into the Asia Pacific market.”
A 210 m² site on the Zhangjiang Hi-Tech Park was selected as the location for Stadium’s RDC office. Located on the Pudong side of the city, this high-tech park is host to a large number of industries including integrated circuits, software, IoT development, biopharmaceuticals, information security, semiconductor illumination and modern agriculture, among others. A significant number of multinationals also have their research and development centres located here. The talent pool in Zhangjiang Hi-Tech Park for electronics engineering and related skills is the best in Asia with a vast pool of experienced skilled doctorates and graduates.
Suggested Items
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.