Hitachi Chemical's Copper-Clad Laminate Subsidiaries Converted into Wholly-Owned
March 28, 2016 | Hitachi Chemical Co., Ltd.Estimated reading time: 1 minute
Hitachi Chemical Co., Ltd. announces the acquisition of a 25% stake each in its two subsidiaries, Hitachi Chemical Electronic Materials (Hong Kong) Limited and Hitachi Chemical Electronic Materials (Guangzhou) Limited, from MTG Laminate (BVI) Limited to convert them into wholly-owned subsidiaries, effective March 18, 2016.
In November 2011, Hitachi Chemical raised its shares in the two subsidiaries that manufacture copper-clad laminates for printed wiring boards to 75% to include as consolidated subsidiaries. This allowed Hitachi Chemical to establish supply systems for copper-clad laminates in the southern and eastern parts of China, major production areas for multilayer wiring boards and semiconductor-related packages used for servers and routers in IT infrastructure as well as high-density wiring boards for modules, offering the opportunity to expand market sales in China and Taiwan region.
At the present time, Hitachi Chemical has acquired an additional 25% stake in both its subsidiaries from MTG Laminate (BVI) Limited to integrate these companies as wholly-owned subsidiaries and enhance its business base in the copper-clad laminate division of Hitachi Chemical Group while taking advantage of the Group's resources. This integration will facilitate quick decision-making and accurate understanding of market trends and needs, contributing to higher levels of customer satisfaction.
Hitachi Chemical will further strengthen and expand its copper-clad laminate business and continue to provide products that meet customer needs.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.