Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

IBM Completes Acquisition of HRL Laboratories to Accelerate the Future of Quantum

08/26/2026 | IBM
IBM announced it has completed its acquisition of HRL Laboratories, LLC (HRL), a leading research and development institution whose expertise spans quantum computing, quantum sensing, advanced communications, electronics, manufacturing, and materials science.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

STMicroelectronics, NUS launch Corporate Lab to power the future of Edge AI in Singapore

08/24/2026 | Globe Newswire
HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.

CACI Selected to Modernize U.S. Space Force Technology Architecture

08/24/2026 | CACI International Inc.
CACI International Inc announced it has been selected to deliver technology that will defend U.S. interests against adversarial threats for the U.S. Space Force.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in