All About Flex: Lean Manufacturing and NPIP for Flexible Circuits
April 21, 2016 | Dave Becker, All FlexEstimated reading time: 1 minute
Many companies are familiar with lean manufacturing concepts and have successfully used these techniques to improve manufacturing processes. Lean techniques, while most often used in printed circuit fabrication and assembly operations, can also be applied to nonmanufacturing processes. One such process is new part number introduction (NPIP).
The main thrust of lean manufacturing is to eliminate or reduce waste. There are typically seven wastes (mudas), as defined by Toyota executive Taiicho Ohno, when he developed Toyota’s Production System (TPS)[1]. (“Muda” is a Japanese word meaning uselessness, idleness or other synonyms of waste.) The seven mudas are:
- Transport
- Inventory
- Motion
- Waiting
- Over-processing
- Over-production
- Defects
The typical part number startup for flexible circuits often can suffer from a number of those wastes. Certain waste items are specific to a part number (customer out of office, conflicts in documentation, iterative design conversations, etc.) or be ingrained as accepted gaps in a supplier’s product launch system. As part of a continuous improvement mentality, wastes should be identified for reduction through a documented and monitored part number introduction process. Some of the more common waste elements are:
Transport: In a new part number introduction process (NPIP), transport is the movement of documentation (electronic or paper) from one department to another requiring successive reviews and sign-offs. Excess transport is a symptom of a departmentalized approach to part number start-up rather than a process flow approach. A cross-functional design review team with one leader can remove departmental barriers and help assure that reviews and inputs are done in parallel rather than serially. Transport can also include sending information requests and approvals to customers and suppliers. These requests need to be challenged regarding their usefulness and necessity.
Editor's Note: This article originally appeared in the March 2016 issue of The PCB Magazine.
Suggested Items
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
HANZA Wins New Customer in Germany
11/25/2024 | HANZAHANZA AB, listed on Nasdaq Stockholm, continues to secure new business, and has entered a manufacturing partnership with a leading German company specializing in advanced measurement equipment for mechanical components.
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
11/25/2024 | Anaya Vardya -- Column: Standard of ExcellenceIn continuing my series on finding, signing, and keeping good people for your company, this month we discuss hiring good people for your quality department. Even when hiring was easier, hiring for the quality department has always been especially challenging. It takes a special kind of person: someone with attention to detail, someone ready to stand for his or her convictions, and someone who can stand up under pressure when the company needs to ship product and the quality manager refuses to because it is not up to par. The quality department is the very soul of any manufacturing company.
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.