Weiner’s World
May 2, 2016 | Gene Weiner, Weiner International Inc.Estimated reading time: 11 minutes
Nothing really new was seen at 26th Flat Panel Display Expo (FINETECH JAPAN) early this month. Primary exhibitors were chemical, material, and manufacturing equipment firms. Most presentations were improvements in existing products. For example in the case of thin films: less thickness, higher heat resistance, longer flexing endurance, smaller loss with high-frequency, or higher dimensional stability—rather than something truly new. Kenshi (Dominique) Numakura, DKN Research covered the show. He stated that these companies were not expecting a huge amount of business; their goal was to engage some potential customers for a future business relationship. A marketing representative from a large company told him that "he had hopes" of attracting one customer with future product application needs. Numakura said, “Everyone in Japan is trying to scratch out a living. No one has thrown in the towel yet, and they all need one lucky break.”
Chinese direct investment in the U.S. rose to a record last year. China's investors placed $15+ billion into 171 transactions in the U.S. According to Rhodium’s China Investment Monitor, they helped add 13,000 full-time jobs for Americans last year.
Never Ending
When I started in this industry nearly 60 years ago there were just two major shows: NEPCON East at the Coliseum in New York, and NEPCON West at the Anaheim Convention Center. This grew to two major show seasons which added exhibits across the Atlantic River (in the UK) and the Pacific Pond (in Japan*) in the spring and fall. Now it appears to be one long never-ending season that all too often shows little that is truly new, presents a major step forward, or a potentially disruptive technology. Visitors roam through these (often regional) events hoping to find that magic bullet that will propel them forward into better yields, lower costs, or a new opportunity. The next such major event is NEPCON China 2016 at the Shanghai World Expo & Convention Center April 26–28.
(*I presented a technical paper at the first INTERNEPCON JAPAN in the early ‘70s when I was VP of business development of OXY Metal Finishing, a subsidiary of Occidental Petroleum. Can you guess what just came in by e-mail? An advertisement for INTERNEPCON Japan, January 18−20, 2017!
Market penetration by "dumping" used, refurbished products?
Apple will try to gain some traction in the world's second largest mobile phone market (India) by importing and selling refurbished iPhones. Apple, which has 2% of the market, is meeting resistance from its "local" competition and may once again be denied access via this route. Four out of five of smartphones there cost less than $150 with some branded phones priced as little as $35.
The Board of Directors of China telecommunications equipment maker ZTE will meet this month to replace three of its most senior executives as a result of the company being accused of violating of U.S. trade rules. The U.S. Department of Commerce slapped trade sanctions on ZTE last month, claiming that it violated rules by exporting American technological goods to Iran and other nations.
IDC announced that the fast-growing 3D printer market continues to be dominated by foreign brands although Chinese vendors are catching up and growing faster. The top five players in the China 3D printer market are all foreign brands: EOS, Stratasys, Renishaw, ZRapid, and Solidscape. Stratasys (Makerbot) and 3D systems also headed the list for desktop models, but the rest of the top five in this category belong to Chinese vendors Xery, Flashforge, and Beijing Tiertime. In terms of China's export market for desktop 3D printers, the top three brands Flashforge, Beijing Tiertime and Winbo account for 50% of the market.
Renewed faith in America's bare board business?
HCI Equity Partners acquired KCA Electronics and Marcel Electronics International Circuits. HCI also announced the appointment of IPC Director Shane Whiteside as President and CEO. Whiteside had worked with HCI before to form and grow TTM.
APCT Holdings Company, the ownership group of APCT Inc., has acquired the Wallingford Connecticut based printed circuit fabricator, Tech Circuits Inc.
Gene Weiner is president of Weiner International Associates. To contact Gene, click here.
Page 2 of 2Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.