Smart Sensor Market Worth $57.77B by 2022
May 9, 2016 | PRNewswireEstimated reading time: 3 minutes
The report "Smart Sensor Market by Type (Temperature & Humidity, Pressure, Touch, Motion & Occupancy, Water, Position, Light), Technology (Mems, CMOS), Component (ADC, DAC, Microcontroller), Connectivity, End-User Industry and Geography - Global Trends and Forecast to 2022", published by MarketsandMarkets, the market is expected to grow from USD 18.58 Billion in 2015 to USD 57.77 Billion by 2022, at a CAGR of 18.1% between 2016 and 2022.
The major drivers for this market include the growing concern toward security & surveillance, rising need for energy-efficient devices, and favorable government initiatives. The growing consumer electronics sector, surge in automotive industry on a global basis, and the growing trend of miniaturization in sensors are the other major factors driving the smart sensor market.
Smart pressure sensor type to hold a major share of the smart sensor market
Pressure sensors are among the key measuring and monitoring sensors used in most end-user industries. Pressure is an important parameter of diverse disciplines such as aerodynamics, thermodynamics, acoustics, fluid mechanics, and biophysics. MEMS-based pressure sensors have been widely utilized in consumer electronics, automotive systems, environmental monitoring, and medical diagnostics sectors among others. Thus, these sensors are expected to hold the major share of the smart sensor market between 2016 and 2022.
Trend of miniaturization in the sensors segment and growing consumer electronics sector are driving the smart sensor market
The tremendous technological developments in the past decade have led to considerable reduction in the size of sensors; for instance, the size of pressure sensor has been reduced from approximately 0.5um to 1 mm. The reduction in the size of these sensors and the adoption of MEMS technology have resulted in a wide horizon of applications for sensors in the fields of automotive, aviation, healthcare, wireless and optical communications, and consumer products. Moreover, the growing demand for smart devices and wearable electronics in the consumer electronics sector are some of the major growth drivers.
Americas to hold the largest market share, APAC to grow at the highest rate
The smart sensor market in the Americas is expected to hold the major market share between 2016 and 2022 owing to the growing demand for smart homes and IoT in the U.S., presence of major players in the region, early adoption of new technologies, and growing automotive and consumer electronics industry. The APAC market is expected to grow at the highest CAGR between 2016 and 2022 owing to the increasing demand from end-user industries such as consumer electronics and automotive.
The competitive landscape of the market presents valuable insights into the various players in the smart sensor market. The smart sensor market report profiles the 16 promising players in the market and describes their business overview, product portfolio, recent developments, and key strategies for growth. Some of the major players considered in the research study are Analog Devices, Inc. (U.S.), Infineon Technologies AG (Germany), STMicroelectronics N.V. (Switzerland), TE Connectivity, Inc. (U.S.), Atmel Corporation (U.S.), NXP Semiconductors N.V. (Netherlands), InvenSense, Inc. (U.S.), Robert Bosch GmbH (Germany), and Sensirion AG (Switzerland) among others.
About MarketsandMarkets:
MarketsandMarkets is the world's No. 2 firms in terms of annual published premium market research reports. Serving 1700 global fortune enterprises with more than 1200 premium studies in a year, M&M is catering to a multitude of clients across 8 different industrial verticals. We specialize in consulting assignments and business research across high growth markets, cutting edge technologies and newer applications. Our 850 fulltime analyst and SMEs at MarketsandMarkets are tracking global high growth markets following the "Growth Engagement Model - GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.