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Advanced Electronics Packaging Digest

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General Dynamics Lands $184M Navy Electronic Warfare Contract

09/29/2026 | General Dynamics
General Dynamics Mission Systems has received a $184.25 million U.S. Navy contract for full-rate production of the Next Generation Electronic Attack Unit (NGEAU), which will support the EA-18G Growler electronic warfare aircraft. The system uses an open mission systems processor architecture designed to provide advanced electronic attack capabilities while allowing the Navy to incorporate technology upgrades over the life of the platform.

Cetec ERP, Boardera Announce Integration Partnership for Faster PCB Assembly Quoting

09/28/2026 | Cetec ERP
Cetec ERP and Boardera Software Inc. have announced an integration partnership designed to help electronics manufacturing services (EMS) and contract manufacturing companies move more efficiently from incoming RFQ to production-ready quote.

FKN Systek Introduces S300 Multiple-Blade PCB Depaneling Saw

09/23/2026 | FKN Systek
FKN Systek now offers the S300 multiple-blade depaneling saw for singulating assembled PCBs. The saw uses a 2.95-inch (75 mm) diameter, 0.021-inch-thick diamond-coated cutting blade.

Yamaha Robotics to Focus on Assembly and Inspection Innovations at EFX 2026 in Stuttgart

09/22/2026 | Yamaha Robotics
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from October 6-8, how advanced surface-mount automation helps companies grow their business and increase productivity.

Mobix Labs Secures Initial F-16 Component Order

09/11/2026 | BUSINESS WIRE
Mobix Labs, Inc., a U.S.-based provider of advanced electronic components and connectivity solutions for aerospace, defense and mission-critical applications, announced that it has secured its initial production order for components supporting the F-16 Fighting Falcon, one of the most widely operated frontline fighters in the U.S. Air Force.
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