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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Kimball Electronics China Supports Nanjing University Through Community Giving Initiative

09/25/2026 | Kimball Electronics
Demonstrating its commitment to creating a positive impact in the community, Kimball Electronics China recently supported students at Nanjing Normal University of Special Education (NNUSE) through a charitable initiative aimed at helping incoming freshmen begin their academic journey.

Fujitsu Develops Diamond-spin Quantum Computer Prototype

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Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

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The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first time in the competition's history, two teams tied for first place.

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A scholarship can change more than just the path to education. The 2026 Foxconn Scholarship Program has launched, offering NT$50,000 per recipient to help young people pursue their dreams with greater peace of mind.
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