A New Way to Control Oxygen for Electronic Properties
June 13, 2016 | Argonne National LaboratoryEstimated reading time: 2 minutes

Hotel managers and materials scientists have a lot in common — they both need to find a way to control properties by managing vacancies.
Researchers at the U.S. Department of Energy's (DOE's) Argonne National Laboratory found they could use a small electric current to introduce oxygen voids, or vacancies, that dramatically change the conductivity of thin oxide films. The results are published in Nature Communications.
The discovery improves our understanding of how these materials work and could be useful for new electronics, catalysts or more.
Scientists are always looking for unusual behaviors in materials that could form the basis of new technologies. Oxides are a class of materials that has garnered much recent interest because they sometimes display such unusual behaviors — flipping between insulating and conducting states, turning magnetism on and off or even becoming superconducting: conducting electricity perfectly, without any loss as heat.
We think some of these properties have to do with oxygen vacancies. The structure of an oxide is a repeating crystalline lattice with oxygen atoms peppered throughout, but sometimes there may be voids where an oxygen atom is missing.
The usual way to create oxygen vacancies is by heating the materials and adding or removing oxygen from the environment.
"But the need to control the gas environment limits where and when you can change the material's properties," said Jeff Eastman, an Argonne materials scientist and corresponding author on the paper.
The Argonne team wanted to find out if they could control vacancies with an alternate method.
They built a two-layer material: an indium oxide crystal layer on top of a block of yttria-stabilized zirconia. When the researchers applied a small electric field, they watched the electrical conductivity skyrocket by two orders of magnitude along the boundary where the two layers meet. The effect is reversible; without the field, it reverts back to the initial, less conductive state.
"You could imagine applications for electronics or building catalysts — for example, providing a way to split water or carbon dioxide," Eastman said.
The theory, assisted by computational modeling, is that the difference between the properties of the two materials creates a vertical voltage between them, and negatively charged oxygen ions in the indium oxide are attracted to the flow and move across the interface — leaving vacancies behind.
The team is planning further investigation into whether the same effects occur in other materials and whether the method could control other properties, Eastman said.
The co-authors on the paper, "Interfacial Control of Oxygen Vacancy Doping and Electrical Conduction in Thin Film Oxide Heterostructures," are Argonne scientists Boyd Veal, Peter Zapol, Hakim Iddir, and Peter Baldo, and Seong Keun Kim, an Argonne postdoctoral researcher during this study, now a research scientist at the Korea Institute of Science and Technology.
The team used beamline 12-ID at the Advanced Photon Source, a DOE Office of Science User Facility, for characterization and analysis. They also used the Fusion cluster at the Argonne Laboratory Computing Resource Center in evaluating the theory developed.
The research was supported by the DOE Office of Science, Office of Basic Energy Sciences.
Suggested Items
The Pulse Design: Constraints for the Next Generation
07/16/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.