UvA Chemists Invent New Supercapacitor Materials
June 14, 2016 | University of California - Santa CruzEstimated reading time: 1 minute
Dr David Eisenberg and Prof. Gadi Rothenberg of the University of Amsterdam's Van ‘t Hoff Institute for Molecular Sciences have invented a new type of supercapacitor material with a host of potential applications in electronics, transportation and energy storage devices. The UvA has filed a patent application on this invention.
Eisenberg and Rothenberg discovered the supercapacitor material during sideline experiments as part of the Fuel Cells project of the Research Priority Area Sustainable Chemistry. Originally, the materials were developed as solid catalytic electrodes for fuel cells. By modifying the surface of these materials the scientists created a highly porous yet well-structured compound, with ample sites for fast redox reactions, inspiring the successful testing for supercapacitance.
The new material combines several practical advantages: It is light, cheap, and non-toxic, and it can be prepared easily on a large scale. This last aspect is crucial for industrial applications, according to Eisenberg: 'Companies making electronic devices look for low-cost, highly reproducible materials with a low environmental impact. The literature abounds with reports of high-performance electronic materials, but these will only be applied if they can be made cheaply in large quantities'.
Energy storage
Supercapacitors are energy storage devices that combine the properties of capacitors and batteries. Batteries have a high energy density (they can store large amounts of energy), but their power density is low (they charge and discharge slowly). Conversely, capacitors enjoy a high power density (they can take and deliver energy quickly) but their energy density is low.
A battery uses its whole bulk for charge storage, while a capacitor uses its surface. Supercapacitors use charge separation through fast ion adsorption, and very fast redox reactions with surface-bound molecules. They have a higher energy density than regular electrolytic capacitors, and also a much higher power density than batteries.
Typically, supercapacitors are used in situations requiring many rapid charge/discharge cycles. Examples include protecting electronic circuits against power surges, regenerative breaking in cars and elevators, and burst-mode power delivery in camera flashes.
Suggested Items
2024 Apple iPad Pro Estimated to Ship Between 4.5 to 5 Million Units
05/08/2024 | TrendForceApple’s recent product launch in May introduced a lineup of new tablets featuring advanced AMOLED screens. Notably, the Pro version boasts a dual-layer tandem structure designed to address the longstanding challenges of screen burn-in and lifespan that are common with AMOLED displays.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.