RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning

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Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark

05/27/2026 | Technica USA
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees from across the electronics manufacturing industry. The event focused on how the rapid evolution of artificial intelligence is driving new manufacturing requirements and changing the technologies used for SMT placement, inspection, and process control.

Rocket Lab Acquires Motiv Space Systems, Adding Mars-Proven Robotics Capabilities

05/27/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced it has completed the acquisition of Motiv Space Systems, a California-based company specializing in space robotics, motion control systems, and precision mechanisms for spacecraft.

Schaeffler, Spire Global Partner to Build Sovereign European Space Infrastructure

05/27/2026 | BUSINESS WIRE
Schaeffler AG, the leading motion technology company, and Spire Global, Inc., a leading global provider of satellite data, analytics and intelligence, have signed a Memorandum of Understanding (MoU) to develop space hardware subsystems, satellite platforms, and advanced radiofrequency (RF) and environmental sensing capabilities.

Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.