Candor Improves Positive Acting Liquid Photoresist Process; Installs ENIPIG Line
June 28, 2016 | Candor IndustriesEstimated reading time: 1 minute

Toronto-based high technology circuit board manufacturer Candor Industries has recently taken steps to improve certain aspects of their fabrication processes.
The team has improved their rigid-flex manufacturing process utilizing positive acting liquid photoresist allowing them to do via filling on rigid areas. By improving their laminating processes and approaching rigid flex in a novel way they have successfully eliminated several processing steps in the manufacture 4-6 layer rigid flex. The elimination of these steps aligns with their simplified process criteria allowing the following to be available for their customers:
- 4-6 layer rigid flex can be done in 5 days
- Even dielectric across rigid areas
- Via filling capabilities for rigid-flex boards
In addition to the photoresist improvements Candor has also recently installed an ENIPIG (Electroless Nickel Immersion Palladium Immersion Gold) line. With the ever rising price of gold, Candor sought out a more affordable alternative to electrolytic nickel gold and electroless nickel electroless gold for their customers that resulted in the ENIPIG installation. Rather than putting 50 micro inches of gold, we put 2-4 micro inches of palladium, saving the customer money. In addition to the price, it also provides the combined benefits of exceptional shelf life, gold wire bondability, solder joint reliability and usage as a press contact surface.
Sunny Patel, Candor’s Technical Sales Manager states, “We’re always seeking new ways to improve our services for our customers. With these changes we’ve made a two pronged improvement by finding ways to lower costs and provide superior, faster products.”
About Candor Industries
Since 1999, Candor Industries has provided 21st Century customers with innovative PCB solutions for complex technologies through a commitment to service and support. Limitations created by standard manufacturing methods led Candor to invent and develop certain technological advancements, helping them to emerge in the forefront as a top of the line solutions provider. Candor continues to push the envelope of PCB manufacturing through continuous R&D, helping both customers and the industry to a brighter future. For more information about Candor, visit them on the web at www.candorind.com or contact Yogen Patel at (416) 736-6306.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.