Strategic Materials Conference Delivers Demand Drivers for New Device and Packaging Materials

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The Strategic Materials Conference (SMC 2016), focusing on “Scaling Challenges: The Future of Materials and Packaging,” will be held September 20-21, at the Computer History Museum in Mountain View, California.  The annual two-day SEMI conference brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in advanced materials. SMC 2016 will delve into what’s driving demand for new materials and packaging and discuss how suppliers are responding to problems posed by existing scaling limitations.

Productivity gains, process improvements, and materials innovation are being combined with novel device packaging approaches. Presentations from representatives of NVIDIA, Samsung, Intel Corporation, ICMTIA China, Tokyo Electron America, GLOBALFOUNDRIES, Micron Technology, Bank of America, Qualcomm Research, STATS ChipPAC and many other industry leaders will discuss trends and opportunities. Professionals interested in industry innovation and business success are encouraged to attend. The sessions include:

• Economic & Market Trends: Industry and Wall Street experts will present findings on trends in materials, equipment, production, and emerging applications.
• Future of Moore’s Law and Encounters of a 3D Kind: Will 2D CMOS scaling pace Moore’s Law or will new 3D options be the pathway to keep on track?
• Disruptive Trends and Opportunities for New Materials: Demand for PCs, tablets, and smartphones is slowing. How quickly will new market segments such as IoT, smart cars, and wearable devices drive demand for new materials?
• Advanced Packaging: Advanced packaging extends the scaling of advanced devices. As a result, competitors are introducing an array of new proprietary packaging technologies and designs.  Innovation in packaging materials is working hard to keep pace.
• Contamination and Metrology Challenges: Devices are increasingly sensitive to contaminants, making detection, identification, and control a focal point in fab operations and the supply chain. How will the industry address contamination control issues at advanced technology nodes?
• Strategic Materials Challenges from the Fab Perspective: Facing flat growth, cost sensitivity, and consolidation, the industry must now focus on next materials needs, supply chain issues, and building collaborative, win-win relationships between manufacturers and suppliers.

About SMC

The Strategic Materials Conference (SMC) provides valuable information and networking opportunities for electronics industry professionals, focusing on the latest developments in advanced electronics materials for the semiconductor and adjacent industries. The conference is organized by the Chemical and Gas Manufacturers Group, a SEMI Special Interest Group comprised of leading manufacturers, producers, packagers, and distributors of chemicals and gases used in the microelectronics industry.

About SEMI

SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.