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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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All About Flex: Taguchi Design of Experiments and Flexible Circuits
July 14, 2016 | Dave Becker, All FlexEstimated reading time: 4 minutes
- Copper anode supplier
- Copper film supplier
- What shift the product is run
- Relative humidity
- Day of the week
The reason these variables were chosen to be part of the noise variables is the company wants to develop a process robust enough to be run in a normal production environment. The reality of most any production environment is there are more noise variables than identified in this example.
So the high and low level settings could be:
Once the noise level variable is determined, the experimental design is similar to a fractional factorial design. Some statisticians have trouble with the “ambiguity” of the noise conditions. The goal is not to understand the noise conditions, but to create two distinct noise levels and see if results are affected.
The Taguchi experiment not only helps in determining what variable settings will yield optimal results, but also what parameter settings are the least affected by the noise. If noise parameters are correctly identified, and process settings are selected with zero noise interaction effects, then a robust process window can result.
Process Robustness vs. Optimal Results
It is possible a set of parameters could yield optimal results, and another set of parameters yields the most robust results. Achieving the optimal output, might require extreme or impractical controls on input variables. Alternatively, robust settings may achieve results that do not meet business goals. Management has to determine if the expense required to achieve optimal parameters justifies the added value provided to the business.
Fractional factorial experiments are very complex and require a good statistical analysis software package. The design and analysis can involve sophisticated statistical calculations. More important is the data interpretation. Management resource allocation is needed to support these types of process improvement efforts. Training employees on proper design experimentation is a key investment and can often result in significant improvement of the factory capability.
Dave Becker is vice president of sales and marketing at All Flex Flexible Circuits LLC.
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Brent Fischthal - Koh YoungSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.