Nano Dimension Files Patent Application for New Nanometric Conductive Ink
July 15, 2016 | PRNewswireEstimated reading time: 1 minute
Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced today that its wholly owned subsidiary, Nano Dimension Technologies, has filed a patent application with the U.S. Patent and Trademark Office for the development of a new nanometric conductive ink, which is based on a unique synthesis.
The new nanoparticle synthesis further minimizes the size of the silver nanoparticles particles in the company's ink products. The new process achieves silver nanoparticles as small as 4 nanometers.
We believe that accurate control of nanoparticles' size and surface properties will allow for improved performance of the company's DragonFly 2020 3D printer, currently in development. The innovative ink enables lower melting temperatures and more complete sintering (fusing of particles into solid conductive trace), leading to an even higher level of conductivity.
The innovative ink has the potential to accelerate printing speeds and save ink for the 3D printing of electronics such as printed circuit boards, antennas and others. Furthermore, the ink enhances the capabilities of the company's DragonFly 2020 3D printer, and may improve the conductivity of the printed lines. The company intends to commercialize its ink products as supplementary products to its 3D printers and as separate and independent products.
About Nano Dimension Ltd.
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems and advanced additive manufacturing. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
Suggested Items
TT Electronics Secures £20 Million in Aerospace and Defence Contracts as European Programmes Accelerate
06/06/2025 | TT ElectronicsTT Electronics has been awarded more than £20 million in new and renewed defence contracts, marking a major step forward in its contribution to Europe’s rapidly evolving defence landscape.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
Essemtec USA Welcomes Frank Hart as Head of Sales for North America
06/05/2025 | Essemtec USAEssemtec USA is proud to announce the appointment of Frank Hart as Head of Sales for North America, effective immediately. With over 30 years of experience in the SMT industry, Frank brings a wealth of knowledge, leadership, and a strong track record of success to our team.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswireNew Era Electronics, a leading provider of high-performance industrial computing solutions, announces the establishment of its first United States location in Salt Lake City, Utah. This strategic expansion to the U.S. underscores New Era Electronics' commitment to enhancing supply chain continuity and delivering exceptional services across North America.