Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Nano Dimension Files Patent Application for New Nanometric Conductive Ink
July 15, 2016 | PRNewswireEstimated reading time: 1 minute
Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced today that its wholly owned subsidiary, Nano Dimension Technologies, has filed a patent application with the U.S. Patent and Trademark Office for the development of a new nanometric conductive ink, which is based on a unique synthesis.
The new nanoparticle synthesis further minimizes the size of the silver nanoparticles particles in the company's ink products. The new process achieves silver nanoparticles as small as 4 nanometers.
We believe that accurate control of nanoparticles' size and surface properties will allow for improved performance of the company's DragonFly 2020 3D printer, currently in development. The innovative ink enables lower melting temperatures and more complete sintering (fusing of particles into solid conductive trace), leading to an even higher level of conductivity.
The innovative ink has the potential to accelerate printing speeds and save ink for the 3D printing of electronics such as printed circuit boards, antennas and others. Furthermore, the ink enhances the capabilities of the company's DragonFly 2020 3D printer, and may improve the conductivity of the printed lines. The company intends to commercialize its ink products as supplementary products to its 3D printers and as separate and independent products.
About Nano Dimension Ltd.
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems and advanced additive manufacturing. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.