-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Inside Spirit Circuits
July 28, 2016 | Barry Matties, I-Connect007Estimated reading time: 15 minutes
Randall: From the quality side of it, I think that there's no longer any point of discussion, it's just taken as a given. Typically, everything is specified around the IPC standards and our default is IPC Class 2, albeit we are able to provide class 3 product as well. The way the business is structured with the volume being offshore and the ability to do quick-turn prototypes here is a real plus for us. The pure brokers don't always have the agility to do that.
Matties: They don't have the control or the knowledge.
Randall: There are obviously small shops available that will provide that service but I think the fact that we've got ownership of that and can start with a part here, provide the samples, prove the technology and keep ownership of that when it goes offshore is hugely attractive to customers.
Matties: Is there anything that we haven't talked about that you think a buyer of circuit boards should be aware of these days?
Randall: That's a very good question. I don't think we find quite so many issues now when we're in receipt of Gerber. In the past you would find some pretty challenging, if not impossible, requirements when you loaded the Gerber up and were doing your DRCs or your MRCs. Certainly that has improved, but so also has the knowledge from a buyer's point of view that PCBs are not an off-the-shelf part. These are all bespoke items.
We have a lot of customer visits here and we take people around like we've just done now. The response is often, "Wow, we did not know there are 20–30 processes to get to that point." It's not like buying a capacitor or buying a resistor from a distributor, and there's a greater appreciation of that now. I think times have moved on and buyers are pretty switched on now. As I said when we were talking before, IPC is the default. Everything tends to get specified around IPC, and that takes care of most things, to be honest.
Matties: The rest really becomes culture and fit, right? You’ve got to do business with who you can do business with.
Randall: Obviously we like to think we know our customers quite well. Certainly our key customers we know very well and we know what is important to them, what ticks the right boxes, and we do different things for different customers. A lot of that is just the way in which we engage and communicate with them. The product itself, remains pretty much the same. It's not so much about the product, it is more about the customer experience, the whole part of dealing with the customer from the point of enquiry to the point of getting their boards. Getting the small things right, that they get the product in the right packaging, in the right weight of packaging and so on. It's important to focus on the finer details right.
Matties: Martin, I appreciate your tour today and your time. Thank you so much.
Randall: You’re welcome. It was my pleasure.
Page 3 of 3Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.