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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI

06/16/2026 | Jesse Vaughan -- Column: Beyond the Board
Autonomous systems are rapidly reshaping the defense landscape. Unmanned aerial systems, autonomous maritime vessels, robotic ground vehicles, loitering munitions, and AI-enabled sensing platforms are now integral components of modern military operations. AI may serve as the brain of an autonomous system, but advanced PCBs form the foundation that allows those capabilities to operate reliably in the field.

GÖPEL's Newly Enhanced Operator Assistance System Improves Assembly Processes

06/15/2026 | GOEPEL electronic
GÖPEL electronic has further developed and enhanced the operation and features of its operator assistance system Multi Line Assist: Assembly instructions are now projected directly into the field of view on the assembly table and onto the assembly.

Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030

06/15/2026 | TrendForce
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.
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