Novel Chemical Sensor Six-times Faster than Alternatives
August 22, 2016 | CORDISEstimated reading time: 2 minutes
"We are making the next generation of sensors that are compact, low cost, low on power consumption and capable of real-time detection where the speed and sensibility is unrivalled," proudly announces Sergio Nicoletti, coordinator of the MIRPHAB project. The new sensor, which reads the unique frequencies given off when liquids or gases interact with light, could soon be installed at the entrance or airports, scanning crowds and bags for suspicious materials before they enter the building.
The latter is actually just one of many potential applications that the team contemplates. Amongst other things, the mid-IT sensor can detect diseases, scan for bacteria in fridges, detect the presence of alcohol or even monitor carbon emissions to help mitigate climate change.
Jose Pozo, director of technology and innovation at the European Photonics Industry Consortium, says this breakthrough could lead to new business and commercial opportunities for SMEs and large industrial groups. The foreseen pilot line will not only enable reduced cost, power consumption and size, but the exploitation of a mixed Si/III-V technology is also foreseen to open the way to applications not addressable with current technologies and components.
Unmatched performance
The new sensor harnesses new photonics technology and uses the MIR wavelength band (3 + 12 μm) for greater performance. In this so-called ‘fingerprint region’, chemicals exhibit intense absorption features that allow for ‘unmatched detection of capabilities and unambiguous identification’.
The device can detect chemicals at a rate of 1 200 per hour – over six times more than standard portal scanners - and is also incredibly small. ‘We want to shrink current technology down to the size of a mobile phone’, says Nicoletti. To achieve this, the R&D process taps into project partners’ expertise in the field of spectroscopy, MIR optolelectronics, sensing systems and applications.
Objective 2020
The MIRPHAB project is built around an 18-strong consortium. It benefits from EUR 13 million of funding from the European Commission’s Photonics Public Private Partnership (PPP) as well as EUR 2 million from the Swiss government.
The team aims to create its supply chain to make ready-for-use sensing devices by 2020. It is one of three manufacturing pilot lines supported by Horizon 2020 to boost Europe’s competitiveness in the sector. The other two are PIX4LIFE, a photonics platform for health applications, and PI-SCALE, which is hoped to accelerate the commercial adoption of OLED technology.
Suggested Items
Textron Systems Collaborates with Kodiak to Develop Uncrewed Military Vehicle
05/20/2024 | PRNewswireTextron Systems Corporation, a Textron Inc. company, a leading developer of crewed and uncrewed military ground vehicles, and Kodiak Robotics, Inc., a leading self-driving technology developer for the trucking and defense markets, announced that they are collaborating to develop an autonomous military ground vehicle specifically designed for driverless operations.
Additive Manufacturing: PCB007 Magazine May 2024 Issue
05/20/2024 | I-Connect007 Editorial TeamThough modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
Terran Orbital’s GEOStare SV2 Captures 3 Years of Success in High-Resolution Imaging
05/17/2024 | BUSINESS WIRETerran Orbital Corporation, a global leader in satellite-based solutions primarily serving the aerospace and defense industries, celebrates the 3rd anniversary of its successful GEOStare SV2 mission. Launched on May 15, 2021, from NASA’s Kennedy Space Center in Florida, GEOStare SV2 has surpassed expectations, delivering exceptional results for commercial satellite imagery.
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.