Global SMT Placement Equipment Market to Grow 6.46% by 2020
August 25, 2016 | PRNewswireEstimated reading time: 1 minute
Research and Markets has announced the addition of the "Global SMT Placement Equipment Market 2016-2020" report to their offering.
The report forecasts the global SMT placement equipment market to grow at a CAGR of 6.46% during the period 2016-2020.
The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Increased applications of SMT placement equipment will be a key trend for market growth. The healthcare industry is also undergoing rapid evolution. Earlier, medical instruments involved manual operation processes, which are increasingly being replaced by smart medical devices. All medical instruments are now engineered with sensors, smart display devices, and complex circuit boards to increase the accuracy of prediction. In addition, every aspect of the medical field is being digitized, requiring SMT placement equipment for pick-and-place operations.
According to the report, high demand from EMS companies will be a key driver for market growth. The technological innovations will lead to a demand for electronic manufacturing services companies worldwide, and may spur substantial investments in new production lines. We infer that new investments would warrant further investments in SMT placement equipment, expanding the market during the forecast period.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.