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'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025

05/02/2025 | TopLine
Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/02/2025 | Marcy LaRont, PCB007 Magazine
In our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

05/01/2025 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.

Empathetic Leadership for Incomprehensible Times

04/30/2025 | Nolan Johnson, SMT007 Magazine
Audrey McGuckin and Catherine Sherman of the McGuckin Group delivered a keynote at the EMS Leadership Summit at IPC APEX EXPO 2025, emphasizing psychological safety and people-centric leadership in the EMS industry. Through personal stories, they fostered an open environment, where attendees learned about empathetic management practices. They introduced the popular BANI (Brittle, Anxious, Non-linear, Incomprehensible) model, underscoring the need for transparency and empathy in today’s complex business landscape. 

Recognizing the IPC Committee Volunteer Awards in 2025

04/24/2025 | Patty Goldman, I-Connect007
In 2023, IPC created two new awards to honor standards development committee volunteers: The Hillman-Lambert Award for Volunteer of the Year and the Kessler-Goldman Award for Committee Leader of the Year. The awards were named after Hall of Fame members whose service to standards development is well-known and who have demonstrated the skills and principles that the awardees should also have.
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