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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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Punching Out!
Column from: Tom Kastner
Tom Kastner is the president of GP Ventures, an M&A advisory services firm focused on the tech and electronics industries. He is a registered representative of StillPoint Capital, LLC—a Tampa, Florida member of FINRA and SIPC—and securities transactions are conducted through it. StillPoint Capital is not affiliated with GP Ventures. Tom has 20+ years’ experience in M&A, corporate development and technology investment management in electronics industry, semiconductors, semiconductor equipment, IoT, distribution, PC boards, contract manufacturing, and components.
Previously, Kastner served as president of Hakuto America, a division of Hakuto Co., Ltd. (a Japanese technology-oriented trading company). He was director of Hakuto’s investment program in the U.S. and Europe, leading and supervising investments in 11 technology companies with a value of $100 million+. He later joined OEM Capital, a technology-focused investment banking firm, gaining five years of deal-making experience. In addition, Tom co-founded an Illinois-based distributor of electronic components, Strategic Switch & Audio.
Tom holds an MBA from Yale University and a BA from the University of California at Berkeley and is fluent in Japanese.