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TFE Acquires TEKENA USA, Expanding Particle Removal and Surface Cleaning Portfolio

09/16/2026 | TFE
TFE, a North American provider of manufacturing equipment, consumable products and technical solutions, announced the acquisition of TEKENA USA LLC, a provider of particle removal and surface cleaning technologies for precision manufacturing applications.

STANIA, Asahi Solder Partner to Strengthen Indonesia’s Tin Downstreaming

09/14/2026 | STANIA
PT Solder Tin Andalan Indonesia (STANIA), a subsidiary of PT Arsari Tambang, and Singapore Asahi Chemical & Solder Industries Pte. Ltd. (Asahi Solder) have signed a Memorandum of Understanding (MoU) to strengthen Indonesia’s tin downstreaming industry through the development of higher-value solder products, enhanced technology and quality capabilities, and expanded market access.

NOR Flash Price Trends Diverge in 2H26, with High-Capacity Products Poised for 90–110% Increases

09/14/2026 | TrendForce
TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and demand in nearly a decade.

DYCONEX Establishes BIOCONEX to Extend its Medical Technology Portfolio

09/09/2026 | DYCONEX
DYCONEX AG announces the establishment of BIOCONEX AG, a wholly owned Swiss subsidiary dedicated to transforming substrate technologies manufactured by DYCONEX into customer-specific, ready-to-integrate sub-components for medical devices.

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.
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