Schmoll Installs Two Direct Image Machines in Two UK PCB Plants
May 8, 2017 | SchmollEstimated reading time: 1 minute
Schmoll has successfully installed two high performance MDI machines, within two high quality UK PCB manufacturers. Both MDIs are two-head systems with the capability of dry film & solder mask productions. Schmoll MDIs are fully flexible systems. For smaller production companies, we have single-head MDI upgradable at any point to suit your needs. Upgrades within your facility with minimal interruption to production. For any high production demands, our five-head MDI or TT system will meet your production demands. Available with automation options to suit our customer’s requirements.
For further information click here.
Or for our North American representative please visit Burkle North America.
About Schmoll Maschinen
Schmoll Maschinen is a supplier of machine tool and mass production solutions for electronic and micro structuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for mechanical and laser micro machining, and is complemented by automation technology.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.