Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
ACJ and Sabena technics to Cooperate in Self-protection
November 1, 2019 | AirbusEstimated reading time: 1 minute
Airbus Corporate Jets (ACJ) and Sabena technics are to cooperate in proposing self-protection systems (SPSs) for Airbus corporate jets.
Each SPS would combine an existing, state-of-the-art, directional infra-red countermeasure (DIRCM) system with installation on an Airbus corporate jet.
SPSs will initially be offered for the ACJ320 Family.
An SPS offers protection against missiles fired from man-portable air defence systems (MANPADS), which are the most widespread missile-threat today.
Self-defence systems are already in service on some Airbus corporate jets.
The co-operation agreement was signed at the NBAA show, by Sabena technics Senior Vice president Sales and Business Development Daniel Soltani and ACJ President Benoit Defforge.
"This is a great new opportunity to work with ACJ on aircraft protection, which builds on an extensive portfolio of business-aviation services that includes cabin-outfitting and maintenance," said Daniel Soltani. "We strongly believe that our ability to install and certificate these systems with airworthiness authorities, such as EASA and the FAA, is a key driver of success."
"Offering self-protection is yet another way in which we care for our customers, and expands and consolidates the widespread range of modern aircraft and services that ACJ offers," said ACJ President Benoit Defforge.
Around 200 Airbus corporate jets are in service worldwide, flying on every continent, including Antarctica.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).