Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
WAGO Unveils Next Generation I/O System Controller with PROFINET
November 20, 2019 | WAGOEstimated reading time: 1 minute
WAGO extends their family of PFC200 Generation 2 controllers with the release of the new 750-8215. The 750-8215 is IIoT-ready, comes with two Ethernet ports, two PROFINET ports, and is programmable with WAGO’s e!COCKPIT software (CODESYS 3.5).
The PROFINET ports are switched for use as a line configuration enabling the controller to function as an I/O device connected to a PROFIBUS master. The two Ethernet ports can be used in a switched configuration or separated, and support other protocols such as EtherCat and Sparkplug (with additional licenses).
Other features of the 705-8215 controller include:
USB-A port with removable memory to extend memory capabilities of the controller
- High Speed processor for complex applications
- Large on-board memory plus SD card slot
- Built-in Web server
- CANopen port allows connection to other devices on a CAN network
This controller can be used for multiple applications and is available now.
For more on the latest from WAGO, visit www.wago.com/us/press-contact
About WAGO
Innovation is at the heart of everything we do at WAGO. From our pioneering CAGE CLAMP® spring pressure connection technology to our extensive range of Interconnect, Interface and Automation solutions, such as the fieldbus independent WAGO-I/O-SYSTEM, our customers count on the unconditional performance and reliability of our products to ensure the safe, efficient operation of their systems every time.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).