Trackwise's 'Improved Harness Technology' Designed into Circuits for Electric Vehicles
April 30, 2020 | Trackwise Designs PLCEstimated reading time: 1 minute

Trackwise Designs has secured a production order for its flexible printed circuit technology, Improved Harness Technology™ (IHT), for delivery in mid 2020. This initial order, in support of initial vehicle production activities, follows successful funded development activities last year for this UK-based designer and manufacturer of electric vehicles.
Trackwise’s IHT is a proprietary roll-to-roll manufacturing process enabling the production of unlimited length, multilayer flexible printed circuits (FPCs). Trackwise’s roll-to-roll technology is being used to manufacture FPCs for use at a module level in both HV and LV circuits in the vehicles' battery packs, reducing the part count, assembly time, and saving on space and weight.
Electric vehicle battery modules are typically cuboid structures of packaged cells which have precisely defined cell connection or monitoring locations that are ideally suited to flex PCBs.
In addition, when battery modules are packaged together to form a complete vehicle battery pack, the battery modules can be connected together by long-length flex PCBs, sometime several metres in length.
Philip Johnston, CEO of Trackwise, commented: "The electric vehicle industry—and specifically EV battery packs—is one of a number of growth markets for Trackwise, and we are delighted to have been selected by an innovator in the field. Following successful development work last year and, more recently, the acquisition of Stevenage Circuits Ltd (SCL) at the beginning of April, this is the next step towards series production of IHT at scale."
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
07/16/2025 | ViTroxViTrox, strives to be the World’s Most Trusted Technology Company, proudly announces the successful conclusion of its fifth edition of High Impact Training for Sales (HITS 5.0), held from 23rd to 27th June 2025 at ViTrox Campus 2.0 and 3.0, located in Batu Kawan Industrial Park, Penang, Malaysia.
Global Citizenship: The Global Push for Digital Inclusion
07/16/2025 | Tom Yang -- Column: Global CitizenshipIt can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.