DARPA Awards BAE Systems Two Awards under WARP Program
April 8, 2021 | BAE SystemsEstimated reading time: 1 minute
BAE Systems will design mechanisms for the U.S. Defense Advanced Research Projects Agency (DARPA) that protect emerging wideband receivers from interference, enabling their use in contested and congested environments. DARPA awarded two contracts to BAE Systems totaling $5 million under the Wideband Adaptive RF Protection (WARP) program which is designed to develop wideband adaptive filtering and signal cancellation architectures to safeguard emerging wideband receivers against both external and self-interference.
Within the Department of Defense, radio frequency (RF) systems must operate within an increasingly crowded electromagnetic spectrum and contend with mission-compromising interference from friendly and hostile sources.
“The ability to control signal strength across the electromagnetic spectrum is critical to the robust operation of wideband RF electronics,” said Chris Rappa, product line director at BAE Systems’ FAST Labs™ research and development organization. “WARP signal filters and cancellers will sense and adapt to the electromagnetic environment through the intelligent control of adaptive hardware.”
The technical areas of the program focus on enhancing electronic warfare technology to improve adaptive control of electromagnetic spectrum – enabling allied forces to freely operate while denying that advantage to adversaries. Specifically, Technical Area 1 is focused on mitigating external interference and Technical Area 2 is focused on mitigating self-interference from co-located transmitters to enable same-frequency simultaneous transmit and receive, also known as STAR.
The WARP awards add to the advanced defense electronics and electronic warfare research and development portfolio and are based on many years of investment on various programs including T-MUSIC, CONverged Collaborative Elements for RF Task Operations (CONCERTO) and Radio Frequency Field Programmable Gate Arrays (RF-FPGA).
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Real Time with... SMTAI 2025: SPEA Bridges the Gap Between Legacy and Next-Generation Test Solutions
11/10/2025 | Real Time with...SMTAIEstablished in Italy in 1976, SPEA designs and manufactures automatic test equipment for various industries, including automotive, aerospace and defense, medical, consumer electronics, and energy. Recognized as one of Italy’s top-performing companies, SPEA continues to innovate in test automation technology. At SMTAI 2025, Dustin Warren, vice president of sales for SPEA America, discussed how the company is bridging the gap between older in-circuit test (ICT) systems and newer, more advanced testing solutions.
Lockheed Martin Revolutionizes AI Integration with STAR.OS™
11/08/2025 | Lockheed MartinLockheed Martin has made a major breakthrough in artificial intelligence (AI) technology with the introduction of the STAR.OS™ solution, a powerful new tool that enables different AI systems to work together smoothly and effectively.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
OSI Systems Reports Fiscal Q1 2026 Financial Results
10/31/2025 | BUSINESS WIREOSI Systems, Inc. announced its financial results for the first quarter of fiscal 2026.