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Flexium Posts 7% YoY Growth in May 2021 Sales
June 7, 2021 | FlexiumEstimated reading time: Less than a minute
Taiwan-based flexible printed circuit (FPC) maker Flexium Interconnect Inc. has reported sales of NT$2.4 billion ($86.55 million at $1:NT$27.72 ) for May 2021, up by 7% compared to May last year, but almost flat from the previous month.
Total sales for the first five months of 2021 reached NT$11.9 billion ($430 million), up by 31.65% compared to the same period last year.
Suggested Items
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Optimizing mSAP to Produce Flex for Biofluid Sensor Probes
10/17/2024 | Dean Neuburger, Sheldahl Flexible TechnologiesImprovements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction
10/16/2024 | I-Connect007 Editorial TeamDesign for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.