Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Powering the Future: The Materials That Make Tomorrow Possible

01/14/2026 | Brian Buyea -- Column: Powering the Future
At Remtec, we live in the intersection where science meets manufacturability, and where reliability isn’t a promise but a measurable outcome. “Powering the Future” isn’t just a slogan. It’s the challenge we face daily as engineers designing metallized ceramic substrates, power packages, and thermal solutions that quietly enable the technologies shaping our world.

Dan’s Biz Bookshelf: ‘Super Performance: 8 Strategies to Reach Full Potential’

01/15/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
Once in a while, a book comes along that doesn’t just inspire; it instructs. George Pesansky’s Super Performance: 8 Strategies to Reach Full Potential for Yourself, Your Team, and Your Organization is a rare gem that’s neither a theory, fluff, nor another feel-good leadership manual. It’s a roadmap for anyone serious about unlocking their full potential and that of those around them.

UHDI Fundamentals: An Overview of UHDI Layer Types

01/02/2026 | Anaya Vardya, American Standard Circuits
UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.

Global Electronics Association Releases Q4 Standards and Revisions Update

12/24/2025 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q4 2025.

Advances in Conformal Coating Materials and Methods

11/19/2025 | Saskia Hogan, MacDermid Alpha Electronics Solutions
High-performance electronics must endure everything from rain, dust, and oil to extreme temperatures, shock, and vibration. These reliability demands now share the stage with other priorities such as size reduction, lightweighting, and environmental sustainability. Combined with constant pressure to cut costs, accelerate production, and boost manufacturing efficiency, material suppliers are racing to develop advanced conformal coatings that deliver it all: compatibility with finer-pitch circuitry, durability, eco-friendliness, and manufacturing efficiency.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in