Nortech Systems Announces Patent for Flexible Faraday Cage PCB and Cable
August 26, 2022 | Nortech SystemsEstimated reading time: 1 minute
Nortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, industrial and defense markets, announced this week that the US Patent Office has issued Patent No. 11,412,608, for the Company’s Flex Faraday Xtreme™, a flexible printed circuit for transmitting high-frequency signals while precisely controlling both crosstalk and impedance, minimizing electromagnetic interference, improving parallel transmission alignment, and increasing data density. This work is based on the important work of Michael Faraday in the 1830s that contributed to our current understanding of shielding effects of what we now call a Faraday Cage.
“Nortech’s commitment to innovative technologies is key to supporting our strategic medical, industrial, and defense customers,” said Jay D. Miller, Chief Executive Officer and President. “In highly complex and compact devices, the FFX is designed to provide the signal integrity necessary to support sensitive, mission-critical applications.”
“With our patent of the Flex Faraday Xtreme (FFX), Nortech provides intelligent transmission lines that provide benefits over traditional micro coax cables in challenging applications,” said Steve Czeck, Senior Director of Engineering. “FFX technology will be applied to meet customer requirements for size or weight constraints, or where harsh conditions exist.”
Both FFX and the recent Active Optical Xtreme™ product launch are early steps in the Company’s long-term pivot toward serving strategic customers by building higher level assemblies that contain advanced technologies and solve difficult connectivity challenges. Invented by Scott Blanc, Principal Engineer, FFX is the Company’s first patent in its technology portfolio. FFX adoption will ramp up through 2023 and will not have a material impact on Nortech's 2022 or 2023 financial results.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
01/16/2025 | onsemionsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
Lockheed Martin Delivers the First Aegis System Equipped Vessel AN/SPY-7(V)1 Radar Antenna to Japan Ministry of Defense
01/16/2025 | Lockheed MartinLockheed Martin successfully delivered the first AN/SPY-7(V)1 radar antenna for the Aegis System Equipped Vessel (ASEV) to the Japan Ministry of Defense.
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025
01/15/2025 | ELMOTECE-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.