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Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

10/17/2024 | Dean Neuburger,  Sheldahl Flexible Technologies
Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction

10/16/2024 | I-Connect007 Editorial Team
Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. 

Site Consolidation at Würth Elektronik

10/09/2024 | Wurth Elektronik
Würth Elektronik Circuit Board Technology, printed circuit board manufacturer headquartered in Niedernhall, Baden-Württemberg, announced at the company meeting the planned closure of its PCB production in Schopfheim.

Indian PCB Market Projected to Reach $20.17 Billion by 2032

10/05/2024 | openPR
The Indian printed circuit board (PCB) market has witnessed significant growth in recent years, reaching a value of US$4.53 billion in 2023. The market is expected to grow at an impressive compound annual growth rate (CAGR) of 18.1% between 2024 and 2032, eventually reaching a projected value of nearly $20.17 billion by 2032.

Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies

10/03/2024 | Vern Solberg -- Column: Designer's Notebook
Often, our primary goal is to maximize product functionality without increasing product size. Developing a multifunction silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O and terminal pitch variations that have become significantly smaller.
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