Imec’s Nanomesh Electrodes in Pole Position for High-throughput Electrochemical Applications
December 28, 2022 | ImecEstimated reading time: 2 minutes
Imec, together with its partner KU Leuven in EnergyVille, announces an important proof point towards implementation of nanomesh structures in high-throughput industrial processes for energy-related applications such as electrolysers, fuel cells and batteries. The researchers have developed a 3D structure made of interconnected nanowires, which can now be used as a freestanding electrode in electrochemical flow cells. The results, published in Materials Today Energy, confirm that the use of these structures can yield a 100-fold increase in current density compared to conventional planar nickel electrodes.
Large-scale production of green hydrogen and green hydrocarbons becomes essential to decarbonize industries. Today, two commercially available options exist for megawatt-scale hydrogen production: classical alkaline water electrolysis (AWE) and proton exchange membrane electrolysis (PEM). However, both technologies face challenges that need to be overcome to further improve the competitiveness of large-scale production of green hydrogen.
Researchers from imec and KU Leuven developed a 3D structure of interconnected nanowires. These nanomesh structures combine high porosity with an extremely high surface area, providing plenty of reaction sites. Due to its unique material properties, nanomesh structures are attractive for numerous electrochemical applications, including electrolysis. They can be created via electroplating, an up-scalable fabrication flow, which makes them cheaper than currently used metal foams.
Until now, non-porous support substrates were needed to provide sufficient mechanical robustness to the highly porous nanomesh. However, to exploit these compelling nano-architectures as freestanding electrodes in electrochemical flow cells, it is essential that the gaseous reagents and products can freely flow in and out. Therefore, the nanowire networks must be supported by a porous structure that is accessible from all sides.
Researchers from imec now published their results on a monolithically integrated nickel nanomesh with an open support grid. This improved nanomesh structure allows gaseous reagents and products to be introduced and removed efficiently from the reaction sites. In an experimental setup they demonstrated that the theoretically available surface area of the nanomesh is almost completely available; resulting in a 100-fold current density increase compared to using conventional planar nickel electrodes. The results confirm that the 3.5 micrometer thin nanomesh electrode has incredible potential in throughput and conversion rates.
"To achieve large-scale production of green hydrogen at offshore wind farms, where space is limited, we need to develop compact electrolysers with high efficiency," said Bart Onsia, business development manager at imec. "These results are a promising step towards the development of new electrolysers components, and we are committed to continuing our research in this area to drive the transition to a more sustainable future."
Philippe Vereecken, imec fellow and part-time professor at KU Leuven: “I am excited that we have been able to further enhance our nanomesh materials and demonstrate their potential in an industry-relevant setup. We have chosen nickel for the current demonstrations for hydrogen production, an area in which we partner with VITO within Hyve, a Belgian consortium that pursues cost-efficient and sustainable hydrogen production on gigawatt scale."
“And the versatility of the nanomesh allows for a much wider portfolio of materials and applications. For instance, we can use copper or silver for CO2 reduction in gas diffusion electrodes," adds Nina Planckensteiner, Marie-Curie post-doctoral researcher at imec. “We are excited to continue exploring the potential of the nanomesh for a wide range of electrochemical applications.”
Suggested Items
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.
Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation
10/01/2024 | Michael Carano -- Column: Trouble in Your TankIt has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
09/11/2024 | Michael Carano -- Column: Trouble in Your TankFor 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.