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Foxhole Group Boosts Life Science Capabilities with Accutron Partnership

09/03/2024 | Foxhole Group
Foxhole Group, a private investment firm focused on the industrial sector, announced today that it has added significant depth of expertise in life science and aerospace and defense capabilities to its Foxtronics EMS platform by partnering with the Faldu family to add Accutron to the company’s portfolio of EMS brands.

Marshall, Tech Mahindra to Explore Aerospace and Defense Collaboration

09/02/2024 | Marshall
Marshall and Tech Mahindra, a leading global provider of technology consulting and digital solutions to enterprises across industries, have signed a Memorandum of Understanding (MoU) to identify and develop opportunities to work together across the aerospace and defense domains.

A Less Expensive Defense and Aerospace PCB Fab Startup

08/20/2024 | Alex Stepinski, Stepinski Group
Editor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.

USPACE and EgSA to Form Aerospace Joint Venture in Egypt

08/16/2024 | PRNewswire
USPACE Technology Group Limited is pleased to announce that the Group has signed the strategic partnership agreement with the Egyptian Space Agency (EgSA), in relation to satellite manufacturing and testing, satellite launch, education and training, greatly expanding its business presence in the fast-growing African space market.

UHDI Fundamentals: UHDI Applications for Aerospace

08/13/2024 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.
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