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Making Waves With Solder Paste Jetting

09/11/2024 | Josh Casper, Horizon Sales
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.

Scrutinizing Solder Printing

09/10/2024 | Nolan Johnson, I-Connect007
As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.

iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita

09/09/2024 | iNEMI
iNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.

Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India

09/09/2024 | Indium Corporation
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.

Eutect Overcomes Panel Soldering Challenges with New Gripper

09/06/2024 | Eutect GmbH
The selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.
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