Lithium Prices Rebound, China’s Battery Industry Chain Expected to Recover in May, Says TrendForce
May 10, 2023 | TrendForceEstimated reading time: 1 minute
The ASP of battery-grade lithium carbonate and lithium hydroxide in China saw an MoM decline in the month of April, falling to CNY 198,000/ton (-39%) and CNY 266,000/ton (-33%), respectively, according to TrendForce research. Although the MoM decline in prices has expanded, lithium salt prices began to show signs of stabilization and rebounded in late April. Additionally, prices of lithium hexafluorophosphate (LiPF6)—a key raw material used in electrolytes— have recently started to rise again, prices of anode materials, iron phosphate, and lithium battery copper foil have almost bottomed out, and China’s EV battery industry chain is gradually stabilizing.
Lithium salt prices experienced a five-month decline before stabilizing and rebounding in April. This allowed the prices of various li-ion battery products to return to levels observed prior to the surge in demand at the end of 2021. Specifically, in April, the ASP of EV square ternary cells, LFP cells, and pouch ternary power cells were CNY 0.83/Wh, CNY 0.74/Wh, and CNY 0.87/Wh, respectively. Taking a look at battery cells used in energy storage equipment, lithium iron phosphate (LFP) storage cells declined 10.5% MoM in April to around CNY 0.74/Wh. However, the price of LFP materials has recently begun to rise, and businesses are receiving more orders. As for battery cells used in consumer electronics, the ASP of cobalt lithium (LCO) cells in April was CNY 8.54/Ah (USD 1.24)—a 9% MoM decline—and the market has been showing signs of recovery.
TrendForce observes that Chinese EV battery manufacturers are nearing the end of their inventory reduction efforts, and the relationship between supply and demand has gradually normalized after more than a quarter period of market adjustments. Furthermore, current battery material prices are stabilizing and market demand is steadily increasing, indicating that China’s battery industry chain is gradually recovering. Total recovery is expected in June as downstream demand continues to pick up.
Suggested Items
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.