Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Supercomputer Fugaku Retains First Place Worldwide in HPCG and Graph500 Rankings
May 23, 2023 | JCN NewswireEstimated reading time: 1 minute
The supercomputer Fugaku, jointly developed by RIKEN and Fujitsu, has successfully retained the top spot for seven consecutive terms in multiple major high-performance computer rankings including HPCG and Graph500 BFS (Breadth-First Search), and has also taken second place for the TOP500 and third place for the HPL-MxP (formally HPL-AI) rankings. The HPCG is a performance ranking for computing methods often used for real-world applications, and the Graph500 ranks systems based on graph analytic performance, an important element in data-intensive workloads. The results of the rankings were announced on May 22 at ISC2023 High-Performance Computing Conference, which is currently being held in Hamburg, Germany.
The top ranking on Graph500 was won by a collaboration involving RIKEN, Kyushu University, Fixstars Corporation, and Fujitsu. It earned a score of 137,096 gigaTEPS this time with Fugaku's 152,064 nodes, an improvement of about 33% in performance from the previous measurement.
The other results this time were made with Fugaku's full complement of 158,976 nodes fit into 432 racks. On HPCG, it scored 16.00 petaflops. On the TOP500, it achieved a LINPACK score of 442.01 petaflops, and on HPL-MxP it gained a score of 2.004 exaflops.
Fugaku has been creating impressive results at the social implementation level in a wide range of fields, including life sciences, disaster prevention and mitigation, energy, manufacturing, basic science, and socioeconomic applications, since its trial use started in April 2020 and the shared use started in March 2021.
Fujitsu commercially launched its cloud-based HPC solution, Fujitsu Computing as a Service (CaaS) in Japan in October 2022. This service makes it easy for anyone, not only professional engineers, to use advanced computing resources based on Fugaku and other HPC technologies, as well as Fujitsu’s quantum-inspired Digital Annealer, which solves combinatorial optimization problems rapidly, and software technologies such as AI.
Moving forward, Fujitsu will continue to collaborate with customers to accelerate initiatives leveraging the technological capabilities offered by its CaaS platform to contribute to the solution of issues facing society, including infectious disease countermeasures, personnel shortages in transportation and delivery, and the development of new high-performance materials.
Share on:
Suggested Items
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.