Northrop Grumman’s B-2 Capabilities Enhance its Digital Communications
August 14, 2023 | Northrop GrummanEstimated reading time: 1 minute
Northrop Grumman Corporation, in partnership with the U.S. Air Force, successfully completed an integrated airborne mission transfer (IAMT) demonstration with the B-2 Spirit at Whiteman Air Force Base as part of the ongoing modernization efforts incorporating digital engineering.
IAMT delivers an advanced capability that enables the B-2 to complete a digital, machine-to-machine transfer of new missions received in flight directly into the aircraft. IAMT is part of Northrop Grumman’s B-2 Collaborative Combat Communication (B2C3) Spiral 1 program that digitally enhances the B-2’s communications capabilities in today’s battlespace.
“We are providing the B-2 with the capabilities to communicate and operate in advanced battle management systems and the joint all-domain command and control environment, keeping B-2 ahead of evolving threats,” said Nikki Kodama, vice president and B-2 program manager, Northrop Grumman. “The integration of this digital software with our weapon system will further enhance the connectivity and survivability in highly contested environments as part of our ongoing modernization effort.”
The demonstration included approximately 50 mission transfers during a two-day period in partnership with the Air Force. Aircraft vehicle 1086, the Spirit of Kitty Hawk, was configured with Northrop Grumman’s Multi Mission Domain (MMD) architecture. MMD is an open mission system architecture for the B-2 that allows rapid and affordable fielding of modern mission capabilities. The mission transfers utilized MMD to integrate with the B-2 Adaptable Communications Suite (ACS).
In the demonstration, the aircrew received an incoming transmission from the ACS ground station, which loaded the mission directly through MMD interfaces to the B-2 Disk Drive Unit. B-2 flight crews can now focus more on mission execution in today’s dynamic battlespace thanks to progressive digital technology.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
David Schild Addresses Printed Circuit Board Issues as a Panelist at AUVSI
10/30/2025 | PCBAAOn October 28, Printed Circuit Board Association of America executive director David Schild appeared on a panel at the Association for Uncrewed Vehicle Systems International (AUVSI) conference on the topic of “First Supply Chains: Strengthening the Industrial Base for Autonomy.” PCBAA sponsored the event and Schild shared his views on issues facing the American microelectronics industry.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.
Global Electronics Association Releases Fall Schedule of Instructor-led Courses
10/20/2025 | Corey Lynn, Global Electronics AssociationWhether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.