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Aluminum Base Circuit Technology: Structures and Manufacturing MethodsOctober 21, 2014 | Joe Fjelstad, Verdant Electronics
Estimated reading time: 1 minute
Aluminum is an attractive material for use in the manufacturing of electronic assemblies owing to its low cost, good thermal properties, dimensional stability, environmental friendliness, and ubiquity. Unfortunately, due to its innate thermal spreading ability, it is not easily used when solder is required to make interconnections to components. This article describes ways to manufacture electronic assemblies using aluminum as a base and eschewing the use of solder.
RoHS restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder, followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. Since 2006, the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.
Most of the problems which have confronted the electronics manufacturing industry have related to the solder assembly process. Lead-free solders were advertised early on as a drop-in replacement for traditional tin lead solders; however, field experience proved it not to be the case. The tin-rich alloys, along with the higher temperatures required for assembly, cause the industry to scramble for solutions to such problems as champagne voids, poorer wetting, brittle solder joints, copper dissolution, tin whiskers, head-in-pillow, greater vulnerability to damage caused by explosive outgassing of absorb moisture in packages among others including cleaning of baked on fluxes following the high temperature assembly process. Lead-free solder also had spillover effects on the PCB laminate material itself as manufacturers experienced delamination and degradation of the resins used in traditional circuit construction. One more recently encountered problem is a phenomenon referred to as pad cratering, wherein resin beneath the copper land to which a component is attached is actually torn loose from the surrounding resin breaking through the copper and causing an open.
Read the full article here.
Editor's Note: This article originally appeared in the September 2014 issue of The PCB Magazine.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.