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Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process

09/21/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.

Plasma-Therm Announces Acquisition of Thin Film Equipment SrL

09/20/2023 | Plasma-Therm
Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, announced that it has acquired Thin Film Equipment SrL (TFE), effective September 18, 2023.

TSMC Accelerates Renewable Energy Adoption, Moves RE100 Target Forward to 2040

09/19/2023 | TSMC
To respond to climate change and mitigate climate impact, TSMC announced an acceleration of its RE100 sustainability timetable, moving its target for 100% renewable energy consumption for all global operations forward to 2040 from 2050.

Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute

09/18/2023 | Intel
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.

MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

09/14/2023 | MediaTek
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
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