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Advanced Electronics Packaging Digest

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Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/13/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials

08/10/2026 | Polar Instruments
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi material families in the stack documentation, giving users “at a glance” visual views of material types in a stack.

Qualcomm Completes Acquisition of Modular

08/07/2026 | Qualcomm Incorporated
Qualcomm Incorporated announced that it has completed its acquisition of Modular Inc, a leading innovator in AI-native software infrastructure.

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

Visionbay.ai Launches Taiwan’s Largest NVIDIA HGX B300 AI Cluster

08/04/2026 | Foxconn
Visionbay.ai, an NVIDIA Cloud Partner (NCP) in Taiwan, announced the commercial launch of its first 5MW AI cluster powered by NVIDIA HGX B300 systems, the largest deployment of its kind nationwide.
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