Acquisition of IBM's Semiconductor Business by GLOBALFOUNDRIES is CompletedJuly 2, 2015 | IBM
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IBM today announced that the acquisition of the company’s global commercial semiconductor technology business by GLOBALFOUNDRIES has been completed.
With the closing of this transaction, GLOBALFOUNDRIES becomes IBM's exclusive semiconductor processor technology provider for the next 10 years, ensuring a long-term supply of semiconductors for IBM systems. IBM Research will continue its deep focus on fundamental semiconductor and material science research and systems innovation to drive IBM’s leadership in mainframe, Power and storage systems as well as future cloud, big data and analytics systems.
“This announcement is the next step in our long-standing relationship with GLOBALFOUNDRIES. IBM continues to invest in systems leadership, innovation and talent for the long-term,” said Tom Rosamilia, senior vice president, IBM Systems. “IBM is designing and developing IT systems for the digital era -- including servers, storage and middleware that will empower our clients to drive new workloads and new business models.“
IBM expects its unparalleled semiconductor and materials research, which has delivered such breakthroughs as copper chips, silicon germanium and quantum computing research, to continue to advance its capabilities in systems for years to come.
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The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.