The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
BAE Systems Installs ACE's KISS-103IL Selective Soldering System
July 30, 2015 | ACE Production Technologies, Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, is pleased to announce that the BAE Systems’ Fort Wayne operations has invested in a KISS-103IL in-line selective soldering system.
The KISS-103IL selective soldering system has been installed at the BAE Systems facility located in Fort Wayne, Indiana and is the third selective soldering machine BAE Systems has ordered from ACE Production Technologies.
“The KISS-103IL is a fully-configured SMEMA compatible selective soldering platform equipped with “Super Quick” processing speeds and the unique dual solder nozzle systems enabling the use of multiple nozzle shapes within the same program,” said Alan Cable President of ACE Production Technologies. “The KISS-103IL comes standard with the ACE automated fiducial location and correction system that offers seamless fiducial recognition and true automated X-Y alignment and corrects any skew of the printed circuit board.”
Cable added, “Other innovative features include the new SWAK-OS machine operating software which is a revolutionary graphics-based programming and editing machine control system that features fast program loading and program recall with minimal operator intervention. A major benefit of the SWAK-OS is the integrated board scanning function that automatically captures and saves an image of a printed circuit board to the selective soldering program.”
BAE Systems is a multinational defense, security and aerospace company with operations worldwide and is one of the world’s largest defense contractors. They are a global leader in the design and manufacture of defense electronic systems. Their product range includes electronic combat systems, sensors, defensive systems, communication systems, surveillance and targeting systems, military and civilian flight and engine controls, and hybrid drive systems.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, visit www.ace-protech.com, call 509-924-4898 or email sales@ace-protech.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.