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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Mentor Video: Impact of Power Integrity on Temperature
August 2, 2016 | Mentor GraphicsEstimated reading time: Less than a minute
One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-thermal co-simulation to properly characterize.
HyperLynx PI does an iterative co-simulation to include the effects of current density on temperature rise, and the effect of temperature on current density and voltage drop, to quickly pinpoint problems in your PCB's power distribution network. This new video explains how designers can keep their PDS from feeling the heat.
To view this video, click here.
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Brent Fischthal - Koh YoungSuggested Items
Make the Smart Move
04/07/2026 | Stephen V. Chavez, Siemens EDAIt’s incredibly easy to become fixated on shiny new EDA software, the latest high-speed routing algorithms, or the most advanced fabrication techniques. New tools and technologies are creating sophisticated simulation platforms that automate routing, check design rules, and simulate performance. However, they cannot replicate the nuanced judgment, imaginative solutions to space constraints, or collaborative spirit that define printed circuit engineering excellence. That is your most significant return on investment.
Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio
04/06/2026 | BUSINESS WIREKeysight Technologies, Inc. announced Keysight Assembly, a new virtual process simulation solution designed to help manufacturers identify assembly issues earlier in development, before they become costly production problems.
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.
Aegis Software Completes Acquisition of Simio
01/27/2026 | PRNewswireAegis Software, a global provider of manufacturing execution and operations software for diverse manufacturing industries, announced that it has completed the acquisition of Simio, a leading provider of Digital Twin Simulation software and Advanced Planning and Scheduling (APS) to an attractive and resilient set of end-markets.
Pulsonix 14.0 Adds Embedded Simulation, Smarter 3D Views, Enhanced Workflow
10/08/2025 | PulsonixPulsonix, the EDA company delivering technology-leading PCB design solutions, is proud to announce the launch of Pulsonix 14.0, its latest PCB design software platform.