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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Mentor Video: Impact of Power Integrity on Temperature
August 2, 2016 | Mentor GraphicsEstimated reading time: Less than a minute

One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-thermal co-simulation to properly characterize.
HyperLynx PI does an iterative co-simulation to include the effects of current density on temperature rise, and the effect of temperature on current density and voltage drop, to quickly pinpoint problems in your PCB's power distribution network. This new video explains how designers can keep their PDS from feeling the heat.
To view this video, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Siemens Leverages AI to Close Industry’s IC Verification Productivity Gap in New Questa One Smart Verification Solution
05/13/2025 | SiemensSiemens Digital Industries Software announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and scalability with AI to push the boundaries of the Integrated Circuit (IC) verification process and make engineering teams more productive.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
04/08/2025 | RanovusCerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.